The development and production sites of IT products can be evaluated and certified separately pursuant to the Common Criteria. The operator of such a site can make an application at BSI to have a site certified pursuant to CC. Such site certification occurs, as a rule, with a view towards reusing the results in later certification processes for IT products that are developed or produced at this location. Site certifications makes synergies in the product certifications possible if, for example, different products of the same type and possibly from different developing companies are produced at one site.
The CC Supporting Document Guidance Site-Certification (PDF, 408KB, File does not meet accessibility standards) is also used in particular during the evaluation.
The consideration of a site certificate in a product certificate occurs in the scope of the product evaluation in the case of the Common Criteria Lifecycle - ALC assurance class. The particular process rules for inclusion are defined in the specific AIS documents.
Site certificates are not automatically subject to the international recognition agreements, but their inclusion in the results of a site evaluation is supported in the scope of the agreements. The certification body concerned with the inclusion makes the individual decisions.
Search results 1 to 10 from a total of 37
|BSI-DSZ-CC-S-0074-2016||United Microelectronics Corporation Headquarters and Fab12A||United Microelectronics Corporation (UMC)||04.11.2016|
|BSI-DSZ-CC-S-0089-2017||United Microelectronics Corporation Fab 12i, No 3, Pasir Ris Drive 12, Singapore 519528||United Microelectronics Corporation (UMC)||05.10.2017|
|BSI-DSZ-CC-S-0102-2018||Taiwan Semiconductor Manufacturing Company, Limited, Fab 2/5, Fab 8, Fab 14A||Taiwan Semiconductor Manufacturing Company, Limited||22.05.2018|
|BSI-DSZ-CC-S-0069-2016||SPIL, Siliconware Precision Industries Co., Ltd., Chung Shan Facility and Da Fong Facility||Siliconware Precision Industries Co., Ltd.||16.09.2016|
|BSI-DSZ-CC-S-0090-2017||SPIL Hsinchu (SPIL-HS-I-III, i.e. Hsinchu IG & Hsinchu IIIG)||Siliconware Precision Industries Co., Ltd.||15.12.2017|
|BSI-DSZ-CC-S-0105-2018||Siliconware Precision Industries Co., Ltd., Zhong Ke Facility & Hsinchu Facility||Siliconware Precision Industries Co., Ltd.||07.06.2018|
|BSI-DSZ-CC-S-0086-2017||SFA Semicon Co. Ltd. Bumping Factory, 30, 2gongdan 7-gil, Seobuk-gu, Cheonan-si, Chungcheongnam-do, Korea 31075||SFA Semicon Co. Ltd.||24.10.2017|
|BSI-DSZ-CC-S-0060-2016||PWPW SmartApp Development Site||Polska Wytwórnia Papierów Wartościowych S.A.||17.08.2016|
|BSI-DSZ-CC-S-0094-2017||NXP Semiconductors Taiwan Ltd (ATKH), #10, Chin 5th Road, N.E.P.Z, Kaohsiung 81170, Taiwan, R.O.C.||NXP Semiconductors Taiwan Ltd (ATKH)||04.12.2017|
|BSI-DSZ-CC-S-0065-2016||NXP Semiconductors Eindhoven HTC-46.3-west (Development Center)||NXP Semiconductors Netherlands B.V.||31.08.2016|