The development and production sites of IT products can be evaluated and certified separately pursuant to the Common Criteria. The operator of such a site can make an application at BSI to have a site certified pursuant to CC. Such site certification occurs, as a rule, with a view towards reusing the results in later certification processes for IT products that are developed or produced at this location. Site certifications makes synergies in the product certifications possible if, for example, different products of the same type and possibly from different developing companies are produced at one site.
The CC Supporting Document Guidance Site-Certification (PDF, 408KB, File does not meet accessibility standards) is also used in particular during the evaluation.
The consideration of a site certificate in a product certificate occurs in the scope of the product evaluation in the case of the Common Criteria Lifecycle - ALC assurance class. The particular process rules for inclusion are defined in the specific AIS documents.
Site certificates are not automatically subject to the international recognition agreements, but their inclusion in the results of a site evaluation is supported in the scope of the agreements. The certification body concerned with the inclusion makes the individual decisions.
Search results 1 to 10 from a total of 34
|BSI-DSZ-CC-S-0042-2015||NXP Semiconductors Austria GmbH, Mikron-Weg 1, 8101 Gratkorn, Austria, Business Unit Identification (BU ID)||NXP Semiconductors Austria GmbH||17.08.2015|
|BSI-DSZ-CC-S-0049-2015||Advanced Semiconductor Engineering Inc. Kaohsiung Factory (ASEKH), Kaohsiung, Buildings K4, K7, K8, K10, K11, K12||Advanced Semiconductor Engineering Kaohsiung Factory (ASEKH)||09.11.2015|
|BSI-DSZ-CC-S-0057-2015||SMT1, SMARTRAC TECHNOLOGY Ltd. (Thailand), 142 Moo, Hi-Tech Industrial Estate, Tambon Ban Laean, Amphor Bang-pa-In, 13160 …||SMARTRAC TECHNOLOGY Ltd.||28.12.2015|
|BSI-DSZ-CC-S-0054-2016||Ardentec Corporation, Ting-Sing site (T Site) and Kaiyuan site (K Site)||Ardentec Corporation||07.01.2016|
|BSI-DSZ-CC-S-0050-2016||NedCard (Shanghai) Microelectronics Co. Ltd.||NedCard BV||08.01.2016|
|BSI-DSZ-CC-S-0055-2015||NXP Global Distribution Center Hong Kong||NXP Semiconductors Hong Kong Limited||08.01.2016|
|BSI-DSZ-CC-S-0058-2016||Giesecke & Devrient Secure Data Management GmbH, Austraße 101b, 96465 Neustadt bei Coburg||Giesecke & Devrient GmbH||03.03.2016|
|BSI-DSZ-CC-S-0045-2016||NXP Semiconductors France, E Space Park, 45 Allée des Ormes, 06250 Mougins, France, Business Unit S&C, Building C, Level 1 - …||NXP Semiconductors France||17.03.2016|
|BSI-DSZ-CC-S-0046-2016||NXP Semiconductors Germany GmbH, Bayerwaldstraße 11, 81737 München, Business Unit S&C, second floor / west wing||NXP Semiconductors Germany GmbH||17.03.2016|
|BSI-DSZ-CC-S-0053-2016||Bundesdruckerei GmbH, Site for ePassport, eCover, eID card, RP card, -inlay Production||Bundesdruckerei GmbH||22.04.2016|