The development and production sites of IT products can be evaluated and certified separately pursuant to the Common Criteria. The operator of such a site can make an application at BSI to have a site certified pursuant to CC. Such site certification occurs, as a rule, with a view towards reusing the results in later certification processes for IT products that are developed or produced at this location. Site certifications makes synergies in the product certifications possible if, for example, different products of the same type and possibly from different developing companies are produced at one site.
The CC Supporting Document Guidance Site-Certification (PDF, 408KB, File does not meet accessibility standards) is also used in particular during the evaluation.
The consideration of a site certificate in a product certificate occurs in the scope of the product evaluation in the case of the Common Criteria Lifecycle - ALC assurance class. The particular process rules for inclusion are defined in the specific AIS documents.
Site certificates are not automatically subject to the international recognition agreements, but their inclusion in the results of a site evaluation is supported in the scope of the agreements. The certification body concerned with the inclusion makes the individual decisions.
Search results 1 to 10 from a total of 34
|BSI-DSZ-CC-S-0099-2018||Bundesdruckerei GmbH manufacturing site for ePassport, eCover, card, RP card, -inlay||Bundesdruckerei GmbH||20.04.2018|
|BSI-DSZ-CC-S-0095-2018||NedCard (Shanghai) Microelectronics Co. Ltd.||NedCard BV||06.04.2018|
|BSI-DSZ-CC-S-0098-2018||Ardentec Corporation, Ting-Sing site (T Site) and Kaiyuan site (K Site)||Ardentec Corporation||23.03.2018|
|BSI-DSZ-CC-S-0097-2017||AY1, Linxens (Thailand) Co Ltd., 142 Moo, Hi-Tech Industrial Estate, Tambon Ban Laean, Amphor Bang-pa-In, 13160 Ayutthaya, …||Linxens (Thailand) Co Ltd. ehemals SMARTRAC TECHNOLOGY Ltd.||27.12.2017|
|BSI-DSZ-CC-S-0090-2017||SPIL Hsinchu (SPIL-HS-I-III, i.e. Hsinchu IG & Hsinchu IIIG)||Siliconware Precision Industries Co., Ltd.||15.12.2017|
|BSI-DSZ-CC-S-0094-2017||NXP Semiconductors Taiwan Ltd (ATKH), #10, Chin 5th Road, N.E.P.Z, Kaohsiung 81170, Taiwan, R.O.C.||NXP Semiconductors Taiwan Ltd (ATKH)||04.12.2017|
|BSI-DSZ-CC-S-0092-2017||Advanced Semiconductor Engineering Inc. Kaohsiung Factory (ASEKH), Kaohsiung, Buildings K4, K7, K8, K10, K11, K12||Advanced Semiconductor Engineering Kaohsiung Factory (ASEKH)||02.11.2017|
|BSI-DSZ-CC-S-0091-2017||NedCard Wijchen, Bijsterhuizen 2529, NL-6604LM Wijchen, Netherlands||NedCard BV||24.10.2017|
|BSI-DSZ-CC-S-0086-2017||SFA Semicon Co. Ltd. Bumping Factory, 30, 2gongdan 7-gil, Seobuk-gu, Cheonan-si, Chungcheongnam-do, Korea 31075||SFA Semicon Co. Ltd.||24.10.2017|
|BSI-DSZ-CC-S-0093-2017||NXP Semiconductors Thailand (ATBK), 303 Moo 3 Chaengwattana Rd., Laksi, Bangkok 10210, Thailand||NXP Manufacturing (Thailand) Inc.||19.10.2017|