The development and production sites of IT products can be evaluated and certified separately pursuant to the Common Criteria. The operator of such a site can make an application at BSI to have a site certified pursuant to CC. Such site certification occurs, as a rule, with a view towards reusing the results in later certification processes for IT products that are developed or produced at this location. Site certifications makes synergies in the product certifications possible if, for example, different products of the same type and possibly from different developing companies are produced at one site.
The CC Supporting Document Guidance Site-Certification (PDF, 408KB, File does not meet accessibility standards) is also used in particular during the evaluation.
The consideration of a site certificate in a product certificate occurs in the scope of the product evaluation in the case of the Common Criteria Lifecycle - ALC assurance class. The particular process rules for inclusion are defined in the specific AIS documents.
Site certificates are not automatically subject to the international recognition agreements, but their inclusion in the results of a site evaluation is supported in the scope of the agreements. The certification body concerned with the inclusion makes the individual decisions.
Search results 1 to 10 from a total of 35
|BSI-DSZ-CC-S-0107-2018||HID Global CID (PT Jasuindo HID Security), Raya Lingkar Timur Km. 1, Block B, Banjarsari Sidoarjo, Indonesia||HID Global CID (PT JAWS)||27.09.2018|
|BSI-DSZ-CC-S-0114-2018||HID Global Ireland Teoranta, Pairc Tionscail na Tulaigh, Baile na hAbhann, Co. Galway, Ireland||HID Global Ireland Teoranta||19.09.2018|
|BSI-DSZ-CC-S-0108-2018||NXP Semiconductors N.V, Gerstweg 2, 6534 AE Nijmegen, Netherlands||NXP Semiconductors||31.08.2018|
|BSI-DSZ-CC-S-0113-2018||PWPW SmartApp Development Site Warszawa, Poland||Polska Wytwórnia Papierów Wartościowych S.A.||29.08.2018|
|BSI-DSZ-CC-S-0112-2018||NXP HTC-46.3-west Eindhoven||NXP Semiconductors||23.08.2018|
|BSI-DSZ-CC-S-0109-2018||HANA Micron Inc., 77 Yeonamyulgeum-ro, Umbong-Myeon, Asan-Si, Chung-Nam, Korea||HANA Micron Inc.||17.08.2018|
|BSI-DSZ-CC-S-0101-2018||NXP India Private Limited, Manyata Technology Park, Nagawara Village, Kasaba Hobli, Bangalore 560 045, India||NXP India Private Limited||23.07.2018|
|BSI-DSZ-CC-S-0110-2018||Advanced Semiconductor Engineering Inc. Kaohsiung Factory (ASEKH), Kaohsiung, Buildings K4, K7, K8, K10, K11, K12||Advanced Semiconductor Engineering Kaohsiung Factory (ASEKH)||25.06.2018|
|BSI-DSZ-CC-S-0111-2018||Ardentec Singapore Pte. Ltd., 12 Woodlands Loop, #02-00, Singapore 738283||Ardentec Singapore Pte. Ltd.||22.06.2018|
|BSI-DSZ-CC-S-0105-2018||Siliconware Precision Industries Co., Ltd., Zhong Ke Facility & Hsinchu Facility||Siliconware Precision Industries Co., Ltd.||07.06.2018|