The development and production sites of IT products can be evaluated and certified separately pursuant to the Common Criteria. The operator of such a site can make an application at BSI to have a site certified pursuant to CC. Such site certification occurs, as a rule, with a view towards reusing the results in later certification processes for IT products that are developed or produced at this location. Site certifications makes synergies in the product certifications possible if, for example, different products of the same type and possibly from different developing companies are produced at one site.
The CC Supporting Document Guidance Site-Certification (PDF, 408KB, File does not meet accessibility standards) is also used in particular during the evaluation.
The consideration of a site certificate in a product certificate occurs in the scope of the product evaluation in the case of the Common Criteria Lifecycle - ALC assurance class. The particular process rules for inclusion are defined in the specific AIS documents.
Site certificates are not automatically subject to the international recognition agreements, but their inclusion in the results of a site evaluation is supported in the scope of the agreements. The certification body concerned with the inclusion makes the individual decisions.
Search results 1 to 10 from a total of 34
|BSI-DSZ-CC-S-0088-2017||King Yuan Electronics Co., Ltd., Chu-Nan Factory||King Yuan Electronics Co., Ltd. (KYEC)||26.06.2017|
|BSI-DSZ-CC-S-0079-2017||ASE Singapore Pte. Ltd. (ASESG), 2 Woodlands Loop, Singapore 738074||ASE Singapore Pte. Ltd.||16.03.2017|
|BSI-DSZ-CC-S-0047-2016||Samsung Electronics Onyang Factory (Test & Package Center), 158 Baebang-ro Baebang-eup Asan-si, Chungcheongnam-do, Korea …||Samsung Electronics||30.11.2016|
|BSI-DSZ-CC-S-0077-2016||GLOBALFOUNDRIES Singapore Pte. Ltd.||GLOBALFOUNDRIES Singapore Pte. Ltd.||25.11.2016|
|BSI-DSZ-CC-S-0059-2016||HANA Micron Inc., 77 Yeonamyulgeum-ro, Umbong-Myeon, Asan-Si, Chung-Nam, Korea||HANA Micron Inc.||07.11.2016|
|BSI-DSZ-CC-S-0074-2016||United Microelectronics Corporation Headquarters and Fab12A||United Microelectronics Corporation (UMC)||04.11.2016|
|BSI-DSZ-CC-S-0066-2016||NXP Leuven (Development Center)||NXP Semiconductors||20.10.2016|
|BSI-DSZ-CC-S-0069-2016||SPIL, Siliconware Precision Industries Co., Ltd., Chung Shan Facility and Da Fong Facility||Siliconware Precision Industries Co., Ltd.||16.09.2016|
|BSI-DSZ-CC-S-0073-2016||HID Global Ireland Teoranta, Pairc Tionscail na Tulaigh, Baile na hAbhann, Co. Galway, Ireland||HID Global Ireland Teoranta||07.09.2016|
|BSI-DSZ-CC-S-0067-2016||NXP Semiconductors Netherlands B.V., Site Nijmegen, Departments PDC, TOO, MM, ESDT||NXP Semiconductors Netherlands B.V.||01.09.2016|